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Matte and etching of silicon chip, removal of impurities on the back of the wafer

by:Spring Glass     2021-02-21
Matte surface and etching of silicon chip, removal of impurities on the back of the wafer 2019-04-12 1. Glass bead metal oxide layer, carbide black skin, metal or non-metal surface rust removal, such as gravity die casting mold, rubber mold oxide Or the removal of the release agent, the black spots on the ceramic surface, the removal of uranium color, and the rebirth of painting. 2. Teflon (TEFLON), PU, u200bu200brubber, plastic coating, rubber drum (ROLLER), electroplating, metal spray welding, titanium plating and other pre-treatments to increase surface adhesion. 3. Removal of burrs from bakelite, plastic, zinc, aluminum die-casting products, electronic parts, magnetic cores, etc. 4. Parts of aerospace, defense, precision industry, derusting, delustering, refurbishment and other stress relief processing. 5. The matte and etching of silicon chips, the removal of impurities on the back of the wafer, the overflow of glue in electronic parts packaging, the removal of printing on the surface of the finished product, and the cleaning of ceramic electric heating
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